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  • MIL-PRF-31033A
  • MIL-PRF-31033A
    商品描述:MIL-PRF-31033A, PERFORMANCE SPECIFICATION, CAPACITORS, FIXED, CERAMIC DIELECTRIC, HIGH RELIABILITY, DISCOIDAL, GENERAL SPECIFICATION FOR (3 NOV 2003)., This specification covers the requirements for high reliability, discoidal, ceramic dielectric, fixed c
  • MIL-PRF-31032B (SUPPLEMENT 1)
  • MIL-PRF-31032B (SUPPLEMENT 1)
    商品描述:MIL-PRF-31032B (SUPPLEMENT 1), PERFORMANCE SPECIFICATION: PRINTED CIRCUIT BOARD/PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR (31 JAN 2010)., This supplement forms a part of MIL?PRF?31032, dated 31 January 2010.
  • MIL-PRF-31032B
  • MIL-PRF-31032B
    商品描述:MIL-PRF-31032B, PERFORMANCE SPECIFICATION: PRINTED CIRCUIT BOARD/PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR (31 JAN 2010)., This specification establishes the general performance requirements for printed circuit boards or printed wiring boards (herea
  • MIL-PRF-31032A (w/AMENDMENT 1)
  • MIL-PRF-31032A (w/AMENDMENT 1)
    商品描述:MIL-PRF-31032A (w/AMENDMENT 1), PERFORMANCE SPECIFICATION, PRINTED CIRCUIT BOARD/PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR (24 FEB 2006)., This specification establishes the general performance requirements for printed circuit boards or printed wiri
  • MIL-PRF-31032A (SUPPLEMENT 1)
  • MIL-PRF-31032A (SUPPLEMENT 1)
    商品描述:MIL-PRF-31032A (SUPPLEMENT 1), PERFORMANCE SPECIFICATION, PRINTED CIRCUIT BOARD/PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR (17 MAR 2008)., This supplement forms a part of Performance Specification MIL-PRF-31032, dated 24 February 2006 and has been ap
  • MIL-PRF-31032/6 (W/AMENDMENT 1).
  • MIL-PRF-31032/6 (W/AMENDMENT 1).
    商品描述:MIL-PRF-31032/6 (W/AMENDMENT 1)., PERFORMANCE SPECIFICATION SHEET: PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE SIDED, THERMOPLASTIC RESIN BASE MATERIAL, WITH OR WITHOUT PLATED?THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS (10 APR 2009)., This specific
  • MIL-PRF-31032/5 (W/AMENDMENT 1)
  • MIL-PRF-31032/5 (W/AMENDMENT 1)
    商品描述:MIL-PRF-31032/5 (W/AMENDMENT 1), PERFORMANCE SPECIFICATION SHEET: PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS (10 MAR 2009)., T
  • MIL-PRF-31032/3B
  • MIL-PRF-31032/3B
    商品描述:MIL-PRF-31032/3B, PERFORMANCE SPECIFICATION SHEET: PRINTED WIRING BOARD, FLEXIBLE, SINGLE AND DOUBLE LAYER, WITH OR WITHOUT PLATED?THROUGH HOLES, WITH OR WITHOUT STIFFENERS, FOR SOLDERED PART MOUNTING (15 JUN 2010)., This specification covers the generic
  • MIL-PRF-31032/2B
  • MIL-PRF-31032/2B
    商品描述:MIL-PRF-31032/2B, PERFORMANCE SPECIFICATION SHEET: PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED?THROUGH HOLES, FOR SOLDERED PART MOUNTING (14 JUN 2010)., This specification covers the gene
  • MIL-PRF-31032/1C
  • MIL-PRF-31032/1C
    商品描述:MIL-PRF-31032/1C, PERFORMANCE SPECIFICATION SHEET: PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED?THROUGH HOLES, FOR SOLDERED PART MOUNTING (23 MAY 2010)., This specification covers th
  • MIL-PRF-31032/1B (W/ AMENDMENT 2)
  • MIL-PRF-31032/1B (W/ AMENDMENT 2)
    商品描述:MIL-PRF-31032/1B (W/ AMENDMENT 2), PERFORMANCE SPECIFICATION SHEET: PRINTED WIRING BOARD, RIGID, MULTILAYERED,THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED THROUGH HOLES, FOR SOLDERED PART MOUNTING. The requirements for acquir
  • MIL-PRF-31032
  • MIL-PRF-31032
    商品描述:MIL-PRF-31032, PERFORMANCE SPECIFICATION PRINTED CIRCUIT BOARD/PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR (1 NOV 1995) [SUPERSEDES MIL-PRF-55110F]., This specification establishes the general performance requirements for printed circuit boards or pri
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